AnsoftLinks is critical for applications where design automation is necessary to bring together electromagnetic analysis with the design entry and modeling tools used to capture today's intricate design complexity. With AnsoftLinks, selected components in your IC, electronic package or printed circuit board design can be automatically translated and converted into ready-to-simulate models, freeing the engineer from time-consuming and error-prone design re-entry.
Features:
-Generates ready-to-solve projects for:
* HFSS
* SIwave
* Q3D Extractor
* PlanarEM
* TPA
* Icepak
* ANSYS Mechanical
- Generates 3D solid models of selected traces, planes and vias
- Edit stack-up properties, such as individual layer thickness, dielectric constant, and conductivity
- Select nets for translation by net name(s), or point and click on specific traces or region of the board
- Automatic de-featuring of selected nets to minimize model complexity and solution time
- Clip design to reduce translation size for the field solvers
- Unites touching metal into single conductor
- Minimum edge length specification for traces, planes and pads
- IC Layout Specific:
* Exports specific "cells" (and their sub-cells)
* Merge via arrays into a single object to simplify the solid model and speed analysis
- Packaging Layout Specific:
* Generates 3D solid models for wire bonds, solder bumps, solder balls
-Direct setup and import to HFSS for:
* Allegro® Package Designer
* Allegro PCB Designer
* SiP Digital Layout
* Virtuoso® Analog Design Environment
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